Skymax Ⅱ-P adopts aviation carbon fiber integrated molding process, which can cope with harsh operating environments; Quick-release arm and tripod design, with rapid deployment, portability and other characteristics; Integrated modular motherboard avionics, a variety of modular interfaces, compatible with a variety of peripheral interfaces, can be equipped with 4G, 5G, RTK, dual-way image transmission, on-board computer and other auxiliary flight peripherals, support subsequent upgrade accessories for seamless iterative upgrade; Multi-mount interface, can be matched with our standardized load, to meet the application needs of most industries; Dual backup intelligent battery design for a safer flight experience.